@incollection{dahoo:insu-01154803, TITLE = {{Impact of voids in interconnection materials}}, AUTHOR = {Dahoo, Pierre-Richard and Khettab, Malika and Chong, Christian and Girard, Armelle and Pougnet., Philippe}, URL = {https://insu.hal.science/insu-01154803}, BOOKTITLE = {{Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization}}, EDITOR = {Abdelkhalak El Hami et Philippe Pougnet}, PUBLISHER = {{Elsevier}}, PAGES = {Chapter 4}, YEAR = {2015}, DOI = {10.1016/B978-1-78548-014-0.50004-9}, HAL_ID = {insu-01154803}, HAL_VERSION = {v1}, }