Impact of voids in interconnection materials - INSU - Institut national des sciences de l'Univers Access content directly
Book Sections Year : 2015
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insu-01154803 , version 1 (23-05-2015)



Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨10.1016/B978-1-78548-014-0.50004-9⟩. ⟨insu-01154803⟩
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