Book Sections
Year : 2015
Catherine Cardon : Connect in order to contact the contributor
https://insu.hal.science/insu-01154803
Submitted on : Saturday, May 23, 2015-5:37:20 PM
Last modification on : Friday, April 14, 2023-4:46:04 PM
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- HAL Id : insu-01154803 , version 1
- DOI : 10.1016/B978-1-78548-014-0.50004-9
Cite
Pierre-Richard Dahoo, Malika Khettab, Christian Chong, Armelle Girard, Philippe Pougnet.. Impact of voids in interconnection materials. Abdelkhalak El Hami et Philippe Pougnet. Embedded Mechatronic Systems 2. Analysis of Failures, Modeling, Simulation and Optimization, Elsevier, Chapter 4, 2015, ISBN : 978-1-78548-014-0. ⟨10.1016/B978-1-78548-014-0.50004-9⟩. ⟨insu-01154803⟩
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